애널리스트 전망 상향 우세, 매출 +18% 성장. 다만 고점 대비 -53%. 10/26 실적 발표 예정.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chi
2026-10-21 기준 · 출처: SEC EDGAR, FINRA, yfinance · 정보 제공용이며 투자 권유가 아닙니다